主要规格及技术指标

电子加速电压：0.02~30 kV

二次电子像分辨率：≤ 0.6nm@15kV，≤0.7nm@1kV

加速电压：0.2~30 kV

离子成像分辨率：≤4nm(30 kV)

离子加速电压：0.5~30 kV

原位扫描力学台：FT-NMT04（最大驱动力＞100 mN）
Electron optics
• Elstar extreme high-resolution field emission SEM column with:
– Magnetic immersion objective lens
– High-stability Schottky field emission gun to provide stable high-resolution analytical currents
– UC+ monochromator technology
• SmartAlign: user-alignments-free technology
• 60-degree dual objective lens with pole piece protection allows tilting of larger samples
• Automated heated apertures to ensure cleanliness and touch- free aperture exchange
• Electrostatic scanning for higher deflection linearity and speed
• Thermo ScientificTM ConstantPowerTM Lens Technology for higher thermal stability
• Integrated Fast Beam Blanker*
• Beam deceleration with stage bias from 0 V to -4 kV
• Minimum source lifetime: 12 months
Electron beam resolution
• At optimum WD:
– 0.6nmat30kVSTEM – 0.7nmat1kV
– 1.0 nm at 500 V (ICD)
• At coincident point: – 0.6nmat15kV – 1.2nmat1kV
Electron beam parameter space
• Electron beam current range: 0.8 pA to 100 nA
• Accelerating voltage range: 350 V – 30 kV
• Landing energy range: 20 eV – 30 keV
• Maximum horizontal field width: 2.3 mm at 4 mm WD
Ion optics
Tomahawk HT Ion Column with superior high-current performance
• Ion beam current range: 1 pA – 100 nA
• Accelerating voltage range: 500 V – 30 kV
• Two-stage differential pumping
• Time-of-flight (TOF) correction
• 23-position aperture strip
• Max. horizontal field width: 0.9 mm at beam coincidence point
• Minimum source lifetime: 1,000 hours
Ion beam resolution at coincident point
• 4.0 nm at 30 kV using preferred statistical method
• 2.5 nm at 30 kV using selective edge method
Detectors
• Elstar in-lens SE/BSE detector (TLD-SE, TLD-BSE)
• Elstar in-column SE/BSE detector (ICD)
• Elstar in-column BSE detector (MD)
• Everhart-Thornley SE detector (ETD)
• IR camera for viewing sample/column
• High-performance in-chamber electron and ion detector (ICE) for secondary ions (SI) and electrons (SE)*
Stage and sample
High-precision five-axis motorized stage with Piezo-driven XYR axis:
• XY range: 150 mm
• Z range: 10 mm
• Rotation: 360° (endless)
• Tilt range: -10° to +60°
• XY repeatability: 1 μm
• Max sample height: Clearance 55 mm to eucentric point
• Max sample weight: 500 g (including sample holder)
• Max sample size: 150 mm with full rotation (larger samples possible with limited rotation)
• Compucentric rotation and tilt
Vacuum system
• Complete oil-free vacuum system
• Chamber vacuum: <2.6×10-6 mbar (after 24-hour pumping)
• Evacuation time: <5 minutes
Chamber
• E- and I-beam coincidence point at analytical WD (4 mm SEM) • Ports: 21
• Inside width: 379 mm
• Integrated plasma cleaner
Sample holders
• Multi-purpose specimen holder with adjustable height
• Vise specimen holder to clamp irregular, large or heavy specimens to the specimen stage*
• Universal mounting base (UMB) for stable, flexible mounting of many combinations of samples and holders, such as flat and pretilt stubs, and row holders for TEM grids*
• Various wafer and custom holders available by request*

主要功能及特色

1、微纳结构加工，TEM透射电镜样品、原子探针样品制备、原位透射拉伸及压缩芯片样品制备等；

2、原位纳米压痕、原位微柱压缩、原位拉伸、原位疲劳、原位蠕变、悬臂梁等。

使用新的高通量 Tomahawk HT 离子镜筒进行高质量、位点特异性 TEM 和 APT 样品制备
使用可选配的 AutoTEM 5 软件，可进行快速、简单、全自动、无人值守的多位点原位和非原位 TEM 样品制备以及横向切片。
凭借采用 SmartAlign 和 FLASH 技术的一流 Elstar 电子镜筒，可大大缩短各种经验水平的用户获得纳米级信息的时间。
凭借具有更高电流的下一代 UC+ 单色器技术，可以在低能量下实现亚纳米性能，从而显示极为细致的细节信息
可通过多达 6 个集成在镜筒内和透镜下的集成检测器获得具有清晰、精确且无电荷的对比度的较完整样品信息
使用可选的 Auto Slice & View 4 (AS&V4) 软件，可提供较高质量、多模态亚表面和 3D 信息，较精确地瞄准目标区域
对复杂结构进行快速、准确、精确的铣削和沉积，临界尺寸小于 10 nm
由于 150 mm Piezo 载物台和腔内 Nav-Cam 相机的高稳定性和准确性，可根据个体应用需求定制精确的样品导航
基于集成样品清洁管理和专用成像模式（如 DCFI 和 SmartScan 模式）的无伪影成像

主要附件及配置

无